Production process of common circuit board, multilayer board and high frequency board

1. Inner layer: This process is mainly cutting board and inner layer circuit.

1. Cutting board is to cut the CORE and PP used in our stacking to the size we need. At this time, don't think that it is the size of OUTLINE in our design data. The board factory will also imposition to increase the utilization rate of the process.

2 The inner layer circuit mainly uses the principle of exposure imaging to transfer the pattern circuit to the substrate, and then etch and develop to make the circuit.

2. Pressing: It is the process of pressing copper foil, PP and inner circuit board into a multi-layer board. According to the order of layers, they are stacked together and pressed in the press.

3. Drilling: It is to drill through holes in the board to connect the lines between layers.

In the drilling process, when we choose the size of the hole when designing, the bigger the bigger. If the hole is small, the drill bit is thin and it is easy to break, so the cost will be high. Although, the process capability can now be 0.2mm.

4. Electroplating: It is to metalize the resin and glass fiber of the non-conductor part on the hole wall. We have finished drilling, the hole wall is non-conductive, and the surface copper has only one layer of bottom copper. We need full board electroplating, via copper, and increase the surface copper.

Fifth, the outer layer: the outer layer circuit is the same as the inner layer principle, which uses the principle of exposure imaging to transfer the graphic circuit to the board.

Sixth, anti-welding: it is the layer of ink outside the board we see, which is generally green, so many people are also called green oil.

Actually, there are red, black, white, yellow and so on. The purpose of anti-welding is to prevent short circuit caused by wave soldering and protect the outer circuit. Our design is generally 3mil larger than the outer layer.

7. Text: This process directly uses the text screen to directly print the text on the PCB.

8. Surface treatment: This process is to coat the exposed copper with a layer of material to protect the copper surface and facilitate welding. The surface treatment includes gold, tin, silver, gold finger, tin spray, OSP and so on.

Nine, molding: make the board into the size we need. That is the outline in our design. In this process, if there is V_CUT, gold finger bevel etc. are also made in this process.

Ten. Test: The test of this process mainly refers to electrical test, which is often referred to as flying probe or jig test. Normal samples are tested with flying probes, just edit the program and the machine will test directly, but it takes a long time. The jig test requires money to make the jig, but it is fast and is generally used in mass production.